Building The World’s Most Powerful Lasers
To Revive Moore's Law
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The Problem
EUV LITHOGRPHY
The Foundation of Advanced
Chip Manufacturing
The most advanced semiconductor manufacturing relies on Extreme Ultraviolet (EUV) light to perform lithography – the process that determines the resolution and accuracy of the circuit patterns on each chip.
THE EUV BOTTLENECK
Why Today’s EUV Light
Sources Fall Short
Today’s EUV light source – Laser Produced Plasma (LPP) – only provides 25% of the light required by current lithography technology and is physically incapable of meeting the power demands of future lithography technologies and techniques. Today’s light source is a significant limiting factor in advanced semiconductor manufacturing.
The most advanced semiconductor manufacturing relies on Extreme Ultraviolet (EUV) light to perform lithography – the process that determines the resolution and accuracy of the circuit patterns on each chip. EUV lithography is the foundation for advanced chip manufacturing.
EUV lithography is the single most costly part of the chip manufacturing workflow, representing 40% of the cost of each wafer. But it also provides the greatest opportunity for innovation and increased productivity. The world’s most advanced EUV lithography tools can deliver higher
throughput with more powerful EUV light.
The Solution
FREE ELECTRON LASERS
A New Class of EUV Light: Free Electron Lasers
xLight is building the world’s most powerful Free Electron Lasers (FELs) to replace LPP and revolutionize advanced semiconductor manufacturing.
IMPACT AND BENEFITS
Unlocking the Next Generation of Semiconductor Manufacturing
xLight's system will unlock the full potential of current state of the art lithography tools, transform existing semiconductor fab capabilities, and enable next generation chip
production – all while reducing capital and operating expenses.
xLight is building the world’s most powerful Free Electron Lasers (FELs) to revolutionize advanced semiconductor manufacturing. These FELs are capable of producing substantially more EUV power than today’s most advanced light source.
xLight's systems will unlock the full potential of current state of the art lithography tools, transform existing semiconductor fab capabilities, and enable next generation chip production – all while reducing capital and operating expenses.
more chips
By producing 4X more EUV power, xLight enables fabs to manufacture chips with smaller, more efficient feature sizes, increasing output per scanner and extending the capabilities of next- generation lithography.
Deployment of xLight FELs across existing US fabs could increase manufacturing productivity by 50% while deployment alongside green field sites could deliver up to 100% greater productivity.
BETTER QUALITY
Programmable light characteristics and advanced patterning improvements deliver higher yield and tighter process control, producing chips with greater consistency and fewer defects at scale.
LOWER COST
By reducing EUV cost by 50% and eliminating the need for consumables like tin or hydrogen,
xLight's FEL systems significantly lowers capital and operating expenditures for fabs.